Advanced reactive Sputter gas controller
Speedflo - Mini

speedflo™ Mini is a multi-channel closed loop control system for high speed adjustment of a reactive gas for magnetron sputter processes. The Mini has all the same functionality of the standard 8 channel system, but with fewer input and output channels: 2 sensor inputs & 3 MFC outputs. Hence the lower cost Mini unit is ideal for smaller systems with only 1 or 2 magnetron cathodes.

Mini Sensor Head Options Supplied by Gencoa: PM (Plasma Emission Monitoring, narrow band-pass filter), maximum 1 per unit.  Target voltage (to power supply output voltage pin),           maximum 2 per unit. Lambda sensor head,            maximum 1 per unit.

What Speedflo can do Speedflo uses an input from any sensor within the process to provide a high speed actuation to the gas flow. The sensor traditionally used is the plasma intensity of the metal or reactive gas species (e.g. oxygen). This method is called plasma emission monitoring or PM. Speedflo's advanced control architecture can also use other sensor types to provide the feedback from the process. All modes of signal input can be used to control outputs from 1 to 3. Input signals can also be combined to provide a better 'picture' of the process and a more robust control solution in demanding situations (e.g. target voltage, metal line, oxygen line & argon). The advanced process control software with Speedflo is tailored to provide the means to control even the most demanding process.

Typical uses of the speedflo™ Mini unit are as follows: Target voltage based reactive gas control for SiO2, Si3N4, Al2O3, ZnO. PM based control via the oxygen gas or sputtered species intensity in the plasma for SiO2, Al2O3, ZnO, TiO2, Nb2O5, MgO... Mulit-zone gas control from 1 input to 3 separate gas zones for uniformity trimming.