High Target Utilisation - LOOP Option (LP)
for Magnetic Material Sputtering

Patent pending design of magnetics. Possible to use thicker ferro-magnetic material target (ie. 10mm thick Cobalt). Possible to combine with SW and PP options. Any mounting option can be combined. Any anode can be used.

The LOOP magnetic and target design overcomes the problem of sputtering ferro-magnetic target materials. This option can sputter Ni, Co, Fe, etc. targets of typically 4 - 8 times the thickness of conventional very high strength magnetrons. In addition the target use for conventional HS sputtering is low (8 - 20%) due to "pinching" of the magnetic field as the target erodes. The LOOP design can offer target use of 40 - 70%.