High Uniformity Option (HU)

Coating uniformity simulation.   Coating uniformity : up to +/- 1 - 5% at long separation.   Tilting for higher uniformity requests   Suggestion for the system layout.   Possible to combine with SW or PP, HY, HS and LS options.   Any mounting options can be combined.   Any anodes option can be used.

Based upon a specific target size, substrate size and target to substrate separation, a magnetic array can be designed to give a specified uniformity on the substrate. The technique is based upon our High Yield type magnetic array system used in such a way as to tune the erosion across the target surface. The coating uniformity is then simulated based upon the magnetic field shape. Many iterations of magnetic design maybe needed until the optimum shape and uniformity is achieved. This method has been used to create high process efficiency sources for CD, CD-R and DVD coating.

This option is based on our simulation capability. Please refer to the Simulation page for more details.