RF Magnetic Option (HP)
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Magnetic Field Strength on Target surface: 50 - 250 G.
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Suitable for high pressure sputtering.
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Possible to combine with SW, PP, HY and HU options (for non-magnetic material sputtering).
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Any mounting option can be combined.
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Any anodes and the other options can be combined.
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CHANGE THIS
In both RF and DC sputtering some elements and compounds exhibit significant coating rate enhancement, if the magnetic strength is low. Any hence the operation voltage is greatly increased in DC sputtering example of materials are carbon & MoS2.
In RF sputtering the inherent enhanced ionisation of the plasma can result in very low target voltage which may result in low rates. Hence weakening the field can drive the discharge voltage higher & increase rates. |
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